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| 001 | 9780429291890 | ||
| 003 | FlBoTFG | ||
| 005 | 20210906121106.0 | ||
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| 007 | cr ||||||||||| | ||
| 008 | 190510s2019 xx fo 000 0 eng | ||
| 040 |
_aOCoLC-P _beng _erda _cOCoLC-P |
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| 020 |
_a9781000023367 _qEPUB |
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_a1000023362 _qEPUB |
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| 020 |
_a9780429291890 _q(electronic bk.) |
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| 020 |
_a0429291892 _q(electronic bk.) |
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| 020 |
_a9781000023220 _q(electronic bk. : PDF) |
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| 020 |
_a1000023222 _q(electronic bk. : PDF) |
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| 020 |
_a9781000023299 _q(electronic bk. : Mobipocket) |
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| 020 |
_a100002329X _q(electronic bk. : Mobipocket) |
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| 024 | 7 |
_a10.1201/9780429291890 _2doi |
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| 035 | _a(OCoLC)1104036011 | ||
| 035 | _a(OCoLC-P)1104036011 | ||
| 050 | 4 | _aTK7874.84 | |
| 072 | 7 |
_aTEC _x008070 _2bisacsh |
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| 072 | 7 |
_aTEC _x009010 _2bisacsh |
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_aTEC _x021000 _2bisacsh |
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| 072 | 7 |
_aSCI _x013060 _2bisacsh |
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| 072 | 7 |
_aTDC _2bicssc |
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| 082 | 0 | 4 |
_a621.38152 _222 |
| 100 | 1 |
_aPaik, Ungyu, _eauthor _917373 |
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| 245 | 1 | 0 |
_aNanoparticle engineering for chemical-mechanical planarization : _bfabrication of next-generation nanodevices / _cUngyu Paik, Jea-Gun Park. |
| 264 | 1 |
_a[Place of publication not identified] : _bCRC Press, _c2019. |
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| 300 |
_a1 online resource (221 pages : _b186 illustrations). |
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| 336 |
_atext _2rdacontent |
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| 337 |
_acomputer _2rdamedia |
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| 338 |
_aonline resource _2rdacarrier |
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| 520 | _aIn the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems. | ||
| 588 | _aOCLC-licensed vendor bibliographic record. | ||
| 650 | 0 |
_aChemical mechanical planarization. _917374 |
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| 650 | 0 |
_aNanoparticles. _917375 |
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| 650 | 0 |
_aNanoelectronics. _917376 |
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| 650 | 7 |
_aSCIENCE / Chemistry / Industrial & Technical _2bisacsh |
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| 650 | 7 |
_aTECHNOLOGY / Electronics / Microelectronics _2bisacsh _917377 |
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| 650 | 7 |
_aTECHNOLOGY / Engineering / Chemical & Biochemical _2bisacsh _917378 |
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| 700 | 1 |
_aPark, Jea-Gun. _917379 |
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| 856 | 4 | 0 |
_3Taylor & Francis _uhttps://www.taylorfrancis.com/books/9780429291890 |
| 856 | 4 | 2 |
_3OCLC metadata license agreement _uhttp://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf |
| 942 | _cEBK | ||
| 999 |
_c3620 _d3620 |
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