| 000 | 02312cam a2200313Ii 4500 | ||
|---|---|---|---|
| 001 | 9780429063350 | ||
| 008 | 180331s2012 fluad ob 001 0 eng d | ||
| 020 |
_a9780429063350 _q(e-book : PDF) |
||
| 020 |
_z9781439862056 _q(hardback) |
||
| 020 |
_z9781138075405 _q(paperback) |
||
| 024 | 7 |
_a10.1201/b11260 _2doi |
|
| 035 | _a(OCoLC)756484227 | ||
| 050 | 4 |
_aTK7870.15 _b.C54 2012 |
|
| 082 | 0 | 4 |
_a621.38152 _bC518 |
| 100 | 1 |
_aChen, Andrea., _eauthor. _94377 |
|
| 245 | 1 | 0 |
_aSemiconductor packaging : _bmaterials interaction and reliability / _cAndrea Chen, Randy Hsiao-Yu Lo. |
| 264 | 1 |
_aBoca Raton, Fla. : _bCRC Press, _c2012. |
|
| 300 | _a1 online resource (xviii, 198 pages) | ||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
||
| 505 | 0 | _asection 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future. | |
| 520 |
_aIn semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world-- _cProvided by publisher. |
||
| 650 | 0 |
_aMicroelectronic packaging. _94378 |
|
| 700 | 1 |
_aLo, Randy. _94384 |
|
| 776 | 0 | 8 |
_iPrint version: _z9781439862056 _w(DLC) 2011036199 |
| 856 | 4 | 0 |
_uhttps://www.taylorfrancis.com/books/9781439862070 _zTaylor&Francis Host. |
| 942 | _cEBK | ||
| 999 |
_c3530 _d3530 |
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