Semiconductor packaging : (Record no. 3530)

MARC details
000 -LEADER
fixed length control field 02312cam a2200313Ii 4500
001 - CONTROL NUMBER
control field 9780429063350
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 180331s2012 fluad ob 001 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780429063350
Qualifying information (e-book : PDF)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN 9781439862056
Qualifying information (hardback)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN 9781138075405
Qualifying information (paperback)
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1201/b11260
Source of number or code doi
035 ## - SYSTEM CONTROL NUMBER
System control number (OCoLC)756484227
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7870.15
Item number .C54 2012
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.38152
Item number C518
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Chen, Andrea.,
Relator term author.
9 (RLIN) 4377
245 10 - TITLE STATEMENT
Title Semiconductor packaging :
Remainder of title materials interaction and reliability /
Statement of responsibility, etc. Andrea Chen, Randy Hsiao-Yu Lo.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture Boca Raton, Fla. :
Name of producer, publisher, distributor, manufacturer CRC Press,
Date of production, publication, distribution, manufacture, or copyright notice 2012.
300 ## - PHYSICAL DESCRIPTION
Extent 1 online resource (xviii, 198 pages)
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term unmediated
Media type code n
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term volume
Carrier type code nc
Source rdacarrier
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future.
520 ## - SUMMARY, ETC.
Summary, etc. In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world--
Assigning source Provided by publisher.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Microelectronic packaging.
9 (RLIN) 4378
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Lo, Randy.
9 (RLIN) 4384
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Print version:
International Standard Book Number 9781439862056
Record control number (DLC) 2011036199
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="https://www.taylorfrancis.com/books/9781439862070">https://www.taylorfrancis.com/books/9781439862070</a>
Public note Taylor&Francis Host.
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type E-books

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