Semiconductor packaging : (Record no. 871)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 05697cam a2200637Ii 4500 |
| 001 - CONTROL NUMBER | |
| control field | ocn759865955 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | OCoLC |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20210822113952.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m d |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr un||||||||| |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 111024s2012 fluad ob 001 0 eng d |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | OTZ |
| Language of cataloging | eng |
| Description conventions | pn |
| -- | rda |
| Transcribing agency | OTZ |
| Modifying agency | N$T |
| -- | UIU |
| -- | TXA |
| -- | BUF |
| -- | OCLCQ |
| -- | YDXCP |
| -- | OCLCQ |
| -- | OCLCF |
| -- | CRCPR |
| -- | OCLCQ |
| -- | E7B |
| -- | COO |
| -- | DEBSZ |
| -- | UMI |
| -- | DEBBG |
| -- | CDX |
| -- | OCLCQ |
| 019 ## - | |
| -- | 759160154 |
| -- | 847199889 |
| -- | 880637726 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781439862070 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 1439862079 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781283274609 |
| Qualifying information | (MyiLibrary) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 1283274604 |
| Qualifying information | (MyiLibrary) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9781439862056 |
| Qualifying information | (hardback ; |
| -- | acid-free paper) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 1439862052 |
| Qualifying information | (hardback ; |
| -- | acid-free paper) |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC)759865955 |
| Canceled/invalid control number | (OCoLC)759160154 |
| -- | (OCoLC)847199889 |
| -- | (OCoLC)880637726 |
| 037 ## - SOURCE OF ACQUISITION | |
| Stock number | CL0500000427 |
| Source of stock number/acquisition | Safari Books Online |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008090 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008100 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38152 |
| Item number | C518 |
| 049 ## - LOCAL HOLDINGS (OCLC) | |
| Holding library | MAIN |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Chen, Andrea, |
| Relator term | author |
| 9 (RLIN) | 4377 |
| 245 10 - TITLE STATEMENT | |
| Title | Semiconductor packaging : |
| Remainder of title | materials interaction and reliability / |
| Statement of responsibility, etc. | Andrea Chen, Randy Hsiao-Yu Lo. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Boca Raton, Fla. : |
| Name of producer, publisher, distributor, manufacturer | CRC Press, |
| Date of production, publication, distribution, manufacture, or copyright notice | ©2012. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource (xviii, 198 pages) : |
| Other physical details | illustrations |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Media type code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Carrier type code | cr |
| Source | rdacarrier |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | "In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world"-- |
| Assigning source | Provided by publisher. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | "Preface Semiconductor packaging assembly and test is an important manufacturing step necessary to create electronic products. The subject is not understood in much depth, as compared to a subject like circuit design. It is generally believed that this is due to the nature of the topic, as back-end processing of semiconductors is a multidisciplinary area, encompassing materials science, mechanical design, electrical layout and modeling, and many other engineering specialties. This book specifically addresses that shortcoming, especially in the area of materials used for packaging semiconductors and their interactions. Simply put, semiconductor packages are not monolithic entities but are made up of many different components interlocked with the common goal of protecting the integrated circuit while allowing it to communicate with the outside world--the lead frame or substrate on which the chip sits upon, the die attach adhesive to glue the chip down, electrical connections made via metallic bonding wires or bond pad bumps for flip chip attachment, and finally an epoxy molding compound to encapsulate everything for protection. And, those components are made up of very different materials: polymers, composites, metals, and various combinations of those categories. Understanding how the various materials behave and interact as they form the protective barrier for the delicate chip is key for making the package reliable and robust. To gain these insights, a basic knowledge of material properties is necessary, along with determining which behaviors are important to package performance. That takes understanding how a given property is measured and why it is significant"-- |
| Assigning source | Provided by publisher. |
| 590 ## - LOCAL NOTE (RLIN) | |
| Local note | Master record variable field(s) change: 082 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronic packaging. |
| 9 (RLIN) | 4378 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | Semiconductors. |
| Source of heading or term | bisacsh |
| 9 (RLIN) | 4379 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | Solid State. |
| Source of heading or term | bisacsh |
| 9 (RLIN) | 4380 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | General. |
| Source of heading or term | bisacsh |
| 9 (RLIN) | 4381 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | Circuits |
| -- | General. |
| Source of heading or term | bisacsh |
| 9 (RLIN) | 4382 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Material Science. |
| Source of heading or term | bisacsh |
| 9 (RLIN) | 4383 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronic packaging. |
| Source of heading or term | fast |
| Authority record control number or standard number | (OCoLC)fst01019751 |
| 9 (RLIN) | 4378 |
| 655 #4 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| 9 (RLIN) | 313 |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Lo, Randy. |
| 9 (RLIN) | 4384 |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Print version: |
| Main entry heading | Chen, Andrea. |
| Title | Semiconductor packaging. |
| Place, publisher, and date of publication | Boca Raton, FL : CRC Press, Ã2012 |
| International Standard Book Number | 9781439862056 |
| Record control number | (DLC) 2011036199 |
| -- | (OCoLC)751748040 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Materials specified | EBSCOhost |
| Uniform Resource Identifier | <a href="https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=389712">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=389712</a> |
| 938 ## - | |
| -- | Coutts Information Services |
| -- | COUT |
| -- | 23786919 |
| 938 ## - | |
| -- | CRC Press |
| -- | CRCP |
| -- | CRC0KE13046PDF |
| 938 ## - | |
| -- | ebrary |
| -- | EBRY |
| -- | ebr10495995 |
| 938 ## - | |
| -- | EBSCOhost |
| -- | EBSC |
| -- | 389712 |
| 938 ## - | |
| -- | YBP Library Services |
| -- | YANK |
| -- | 6069731 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | E-books |
| 994 ## - | |
| -- | 92 |
| -- | N$T |
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